m ? ? ? @ b ? ? ? ? ? ? l @ i ? n @ q p w y u @ r ? ? ? ? @ r ? n l @ h ? ? ? ? ? l @ t ? ? ? ? @ w w p y y t ? z @ r x q n y x x n t v p p @ @ f ? ? z @ r x q n y x x n t v q u @ @ ? ? ? n ? ? ? ? ? ? ? ? ? n ? ? e r p p u @ m ? ? ? @ b ? ? ? ? ? ? l @ i ? n c m m 0 0 1 6 - b d r n p @ ? ? @ r p n p @ g h ? g ? a ? @ m m i c @ q w @ p ? ? ? ? @ a C ? ? ?
3236 scott boulevard santa clara, california 95054 phone: (408) 986-5060 fax: (408) 986-5095 2.0 to 20.0 ghz gaas mmic 1w power amplifier advanced product information august 2004 (1 of 4) features ? small size: 2.32 x 1.30 x 0.076 mm ? integrated on-chip dc blocking ? single bias operation ? directly cascadable ?fully matched ? unconditionally stable ? p1db: 29 dbm, typ. @ 18 ghz ? linear gain: 9.5 db, typ. @ 18 ghz ? phemt technology ? silicon nitride passivation specifications (ta = 25?, vdd = 12v) 1 parameters units min typ max frequency range ghz 2.0 20.0 linear gain db 8.5 12.5 gain flatness db 1.5 power output: 2-18 ghz (@1 db gain compression) dbm 28.5 power output: 2-20 ghz (@1 db gain compression) dbm 26.5 p1db variation (over operating frequency) dbm 5.0 saturated output power: 2-18 ghz dbm 29.5 saturated output power: 2-20 ghz dbm 27.5 input return loss db -10.0 output return loss db -10.0 current ma 650 690 730 thermal resistance ?/w 15.7 stability 2 unconditionally stable absolute maximum ratings 1 parameter rating drain voltage 9.0v (min.) / 13.0v (max.) drain current 750 ma continuous power dissipation 9.5 w input power 20 dbm storage temperature -50? to +150? channel temperature 175? operating backside temperature -40? to (see note 2) die attach and bonding procedures die attach: eutectic die attach is recommended. for eutec- tic die attach: preform: ausn (80% au, 20% sn); stage temperature: 290?, 5?; handling tool: tweezers; time: 1 min or less. wire bonding: wire size: 0.7 to 1.0 mil in diameter (pre- stressed); thermocompression bonding is preferred over thermosonic bonding. for thermocompression bonding: stage temperature: 250?; bond tip temperature: 150?; bonding tip pressure: 18 to 40 gms depending on size of wire. CMM0016-BD chip diagram notes: 1. operation outside these limits can cause permanent damage. 2. calculation maximum operating temperature: tmax = 175?pdis [w] x 15.7) [?]. units: mm notes: 1. tested on celeritek connectorized evaluation board (standard assembly condition detailed on page 4). 2. stability factor measured on-wafer.
3236 scott boulevard, santa clara, california 95054 phone: (408) 986-5060 fax: (408) 986-5095 CMM0016-BD advanced product information - august 2004 (2 of 4) typical on-wafer scattering parameters (vd = +12v, idd = 700 ma, t = 25?, device in a 50 ohm system) frequency s 11 s 21 s 12 s 22 (mhz) (mag) (ang) (mag) (ang) (mag) (ang) (mag) (ang) 0.1 0.895 -27.46 0.374 -118.79 0.001 179.07 0.982 -30.49 1.1 0.224 -94.72 2.819 -167.62 0.001 10.30 0.371 172.50 2.1 0.120 -115.66 2.845 137.27 0.001 161.31 0.184 155.95 3.1 0.132 -120.35 2.912 98.39 0.001 -24.81 0.109 176.74 4.1 0.116 -142.53 2.906 64.29 0.001 99.46 0.134 -148.11 5.1 0.090 -159.80 2.870 31.44 0.000 -18.80 0.201 -144.37 6.1 0.058 -155.91 2.848 -0.20 0.000 -15.21 0.254 -152.76 7.1 0.045 -135.98 2.839 -31.59 0.001 -9.90 0.273 -163.80 8.1 0.056 -111.34 2.863 -62.57 0.001 -17.50 0.256 -173.33 9.1 0.082 -107.92 2.929 -94.08 0.001 -40.23 0.214 -176.04 10.1 0.105 -116.81 3.014 -126.53 0.002 -66.05 0.186 -165.38 11.1 0.112 -130.45 3.087 -160.15 0.003 -95.26 0.221 -153.79 12.1 0.100 -145.03 3.119 165.56 0.003 -127.63 0.285 -157.63 13.1 0.065 -154.88 3.119 131.34 0.004 -150.95 0.321 -171.26 14.1 0.026 -114.03 3.123 97.11 0.005 -177.36 0.305 170.18 15.1 0.072 -60.29 3.163 62.54 0.006 157.71 0.223 149.10 16.1 0.137 -72.11 3.237 26.78 0.007 130.91 0.078 131.73 17.1 0.185 -90.65 3.312 -10.92 0.009 105.19 0.105 -99.62 18.1 0.202 -109.59 3.326 -50.17 0.011 69.44 0.264 -123.96 19.1 0.182 -125.30 3.296 -90.24 0.011 34.20 0.348 -155.20 20.1 0.134 -132.98 3.213 -131.48 0.012 4.93 0.319 168.29 21.1 0.105 -107.03 3.088 -172.66 0.014 -33.95 0.172 115.92 22.1 0.174 -94.92 3.039 145.86 0.015 -73.77 0.128 -27.54 23.1 0.247 -110.42 3.136 101.21 0.018 -111.05 0.322 -99.37 24.1 0.272 -132.47 3.242 47.32 0.023 -158.10 0.393 -159.52 25.1 0.231 -160.25 2.672 -12.38 0.024 149.27 0.210 107.34 26.1 0.137 -141.31 2.001 -56.79 0.022 119.19 0.301 -40.67 27.1 0.196 -146.43 2.259 -104.68 0.028 69.82 0.492 -112.02 28.1 0.234 -150.80 2.569 153.51 0.030 -17.00 0.547 109.01 29.1 0.349 170.45 0.720 68.96 0.006 -100.97 0.501 -21.16 30.1 0.386 130.23 0.247 26.46 0.002 -28.35 0.584 -59.24 31.1 0.428 92.93 0.104 -5.39 0.003 21.66 0.646 -78.61 32.1 0.480 60.25 0.042 -28.72 0.003 -5.04 0.707 -91.05 33.1 0.539 34.23 0.023 -53.32 0.001 11.16 0.755 -101.84 34.1 0.597 12.71 0.014 -63.64 0.005 -1.35 0.789 -111.75 35.1 0.658 -4.54 0.013 -90.12 0.010 -44.00 0.789 -123.00 36.1 0.706 -19.16 0.007 -169.84 0.008 -171.43 0.763 -120.14 37.1 0.751 -31.72 0.004 138.88 0.002 177.92 0.840 -127.28 38.1 0.790 -42.32 0.001 141.98 0.002 68.47 0.867 -134.25 39.1 0.826 -52.12 0.003 125.45 0.003 -55.70 0.888 -140.59 40.1 0.856 -60.30 0.001 -30.91 0.002 -147.28 0.896 -146.39 s-parameter data files are available on-line at: www.celeritek.com
3236 scott boulevard santa clara, california 95054 phone: (408) 986-5060 fax: (408) 986-5095 CMM0016-BD advanced product information - august 2004 v1.0 (3 of 4) cmm0016 typical on-wafer s-parameter data 12v, 660ma -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10 11 12 13 02468101214161820222426283032 frequency (ghz) linear gain (db), k-factor -35 -30 -25 -20 -15 -10 -5 0 5 10 15 s11, s22 (db) s21 k-factor s11 s22
3236 scott boulevard, santa clara, california 95054 phone: (408) 986-5060 fax: (408) 986-5095 celeritek reserves the right to make changes without further notice to any products herein. celeritek makes no warranty, repres entation or guarantee regarding the suitability of its products for any particular purpose, nor does celeritek assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ?ypical?parameters can and do vary in different applications. all operating parameters, including ?ypicals?must be validated for each customer application by customer s technical experts. celeritek doe s not convey any license under its patent rights nor the rights of others. celeritek products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the celeritek prod uct could create a situation where personal injury or death may occur. should buyer purchase or use celeritek products for any such unintended or unauthorized application, buyer shall indemnify and hold celeritek and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that celeritek was negligent regarding the design or manufacture of the part. celeritek is a registered trademark of celeritek, inc. celeritek, inc. is an e qual opportunity/affirmative action employer. ordering information the CMM0016-BD is available in bare die and is shipped in gel pak. part number for ordering package CMM0016-BD bare die ? assembly example CMM0016-BD advanced product information - august 2004 (4 of 4) note: 1. eutectic attach on at least 30mil thick cuw or cumo carrier is recommend. 2. for evaluation, a 1.4mil wire diameter lithium gold air coil has been used .
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